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Electronic Packaging Materials and Their Properties

By Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

Series Editor: Michael Pecht

CRC Press – 1998 – 128 pages

Series: Electronic Packaging

Purchasing Options:

  • Add to CartHardback: $154.95
    978-0-8493-9625-0
    December 18th 1998

Description

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.

Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

  • interconnections

  • printed circuit boards

  • substrates

  • encapsulants

  • dielectrics

  • die attach materials

  • electrical contacts

  • thermal materials

  • solders

    Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

  • Contents

    Introduction

    Properties of Electronics Packaging Materials

    Electrical Properties

    Thermal and Thermomechanical Properties

    Mechanical Properties

    Chemical Properties

    Miscellaneous Properties

    Zeroth-Level Packaging Materials

    Semiconductors

    Attachment Materials

    Substrates

    First-Level Packaging Materials

    Wire Interconnects

    Tape Interconnects

    Case Materials

    Lid Seals

    Leads

    Second-Level Packaging Materials

    Reinforcement Fiber Materials

    Resins

    Laminates

    Constraining Cores

    Flexible Wiring Board Materials

    Conductor Metals in Laminates

    Conformal Coatings

    Third-Level Packaging Materials

    Backpanel Materials

    Connectors Materials

    Cables and Flex Circuit Materials

    Summary

    Appendices

    Index

    Name: Electronic Packaging Materials and Their Properties (Hardback)CRC Press 
    Description: By Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul MahajanSeries Editor: Michael Pecht. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form,...
    Categories: Electronic Packaging, Electromagnetics & Microwaves