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1-10 of 11 results for Author: michael pecht (sorted by Publication Date, showing all)

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  1. Product Reliability, Maintainability, and Supportability Handbook, Second Edition

    Edited by Michael Pecht

    To ensure product reliability, an organization must follow specific practices during the product development process that impact reliability. The second edition of the bestselling Product Reliability, Maintainability, and Supportability Handbook helps professionals identify the shortcomings in the...

    Published April 16th 2009 by CRC Press

  2. The Japanese Electronics Industry

    By Wataru Nakayama, WIlliam Boulton, Michael Pecht

    The explosive growth of the Japanese electronics industry continues to be driven by a combination of market forces and the unique characteristics of the Japanese social organization and people. As an industrial phenomenon, the Japanese electronics industry receives considerable attention from...

    Published June 25th 1999 by CRC Press

  3. The Chinese Electronics Industry

    By Michael Pecht, Chung-Shing Lee, Wang Yong Wen, Zong Xiang Fu, Jiang Jun Lu

    The Chinese Electronics Industry documents the technologies, capabilities, and infrastructure that has made China a major player in the Asian electronics industry. This book covers the major segments of China's electronics industry, including semiconductors, packaging, printed circuit boards,...

    Published May 20th 1999 by CRC Press

  4. Guidebook for Managing Silicon Chip Reliability

    By Michael Pecht, Riko Radojcic, Gopal Rao

    Series: Electronic Packaging

    Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated...

    Published December 29th 1998 by CRC Press

  5. Electronic Packaging Materials and Their Properties

    By Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

    Series: Electronic Packaging

    Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits...

    Published December 18th 1998 by CRC Press

  6. Influence of Temperature on Microelectronics and System Reliability

    A Physics of Failure Approach

    By Pradeep Lall, Michael Pecht, Edward B. Hakim

    This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at...

    Published April 24th 1997 by CRC Press

  7. Electronics Industry in Taiwan

    By Chung-Shing Lee, Michael Pecht

    Taiwan's electronics industry, especially the semiconductor and information products sectors, is characterized by rapid growth and high potential. This book investigates the past performance, current status, and future development of this industry, providing engineers with important data. Corporate...

    Published February 7th 1997 by CRC Press

  8. The Korean Electronics Industry

    By Michael Pecht, Joseph B. Bernstein, Damion Searls, Martin Peckerar, Pramod C. Karulkar

    The Korean Electronics Industry documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made the Republic of Korea successful in the electronics industry. The book covers the major segments of Korea's electronics industry, including semiconductors, packaging...

    Published February 4th 1997 by CRC Press

  9. Advanced Routing of Electronic Modules

    By Michael Pecht, Yeun Tsun Wong

    Series: Electronic Packaging

    The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next...

    Published October 23rd 1995 by CRC Press

  10. Placement and Routing of Electronic Modules

    Edited by Michael Pecht

    Series: Electrical and Computer Engineering

    This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems.;Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules:...

    Published March 12th 1993 by CRC Press

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