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Electronic Packaging Books

You are currently browsing 1–10 of 37 new and published books in the subject of Electronic Packaging — sorted by publish date from newer books to older books.

For books that are not yet published; please browse forthcoming books.

New and Published Books

  1. Embedded and Networking Systems

    Design, Software, and Implementation

    Edited by Gul N. Khan, Krzysztof Iniewski

    Series: Devices, Circuits, and Systems

    Embedded and Networking Systems: Design, Software, and Implementation explores issues related to the design and synthesis of high-performance embedded computer systems and networks. The emphasis is on the fundamental concepts and analytical techniques that are applicable to a range of embedded and...

    Published September 24th 2013 by Chapman and Hall/CRC

  2. Novel Advances in Microsystems Technologies and Their Applications

    Edited by Laurent A. Francis, Krzysztof Iniewski

    Series: Devices, Circuits, and Systems

    Microsystems technologies have found their way into an impressive variety of applications, from mobile phones, computers, and displays to smart grids, electric cars, and space shuttles. This multidisciplinary field of research extends the current capabilities of standard integrated circuits in...

    Published July 26th 2013 by CRC Press

  3. Extreme Environment Electronics

    Edited by John D. Cressler, H. Alan Mantooth

    Series: Industrial Electronics

    Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing...

    Published November 26th 2012 by CRC Press

  4. Semiconductor Packaging

    Materials Interaction and Reliability

    By Andrea Chen, Randy Hsiao-Yu Lo

    In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

    Published October 10th 2011 by CRC Press

  5. Thermal Computations for Electronics

    Conductive, Radiative, and Convective Air Cooling

    By Gordon Ellison

    A total revision of the author’s previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative...

    Published November 8th 2010 by CRC Press

  6. Introduction to Microsystem Packaging Technology

    By Yufeng Jin, Zhiping Wang, Jing Chen

    The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in...

    Published September 29th 2010 by CRC Press

  7. Practical Guide to the Packaging of Electronics, Second Edition

    Thermal and Mechanical Design and Analysis

    As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis...

    Published December 1st 2008 by CRC Press

  8. Electronic Circuit Design

    From Concept to Implementation

    By Nihal Kularatna

    With growing consumer demand for portability and miniaturization in electronics, design engineers must concentrate on many additional aspects in their core design. The plethora of components that must be considered requires that engineers have a concise understanding of each aspect of the design...

    Published June 2nd 2008 by CRC Press

  9. Electronic Components and Technology, Third Edition

    By Stephen Sangwine

    Series: Tutorial Guides in Electronic Engineering

    Most introductory textbooks in electronics focus on the theory while leaving the practical aspects to be covered in laboratory courses. However, the sooner such matters are introduced, the better able students will be to include such important concerns as parasitic effects and reliability at the...

    Published March 2nd 2007 by CRC Press

  10. Materials for Rigid and Flexible Printed Wiring Boards

    By Martin W. Jawitz, Michael J. Jawitz

    Series: Electrical and Computer Engineering

    Complex electronic circuits and devices are flooding applications in nearly every facet of commercial and industrial activity, from automated equipment to all types of consumer products. Proper selection of materials is crucial to meet the end-use requirements of flexible and rigid printed wiring...

    Published September 22nd 2006 by CRC Press